Data source: physorg 2010-10-28

Flexible circuits can be found in many devices where space and weight considerations are dominant in the design of electronics: in cars, in cameras and video equipment, in mini-computers for athletes or in inkjet printers. And the market continues to grow: according to the business consultancy Frost & Sullivan, sales in this area will grow to more than $16 billion by the year 2014.

At K 2010, the trade fair for plastics in Dusseldorf, Germany, scientists from the IST in Braunschweig will unveil a new reel-to-reel technology for the production of flexible circuits and biosensors; the new technology is known as “P3T”, which is shorthand for “Plasma Printing and Packaging Technology”. The benefits: P3T involves considerably fewer process steps than existing processes, and it conserves raw materials. Unlike previous methods, the researchers do not start with a polymer film metalized over its entire surface from which excess metal is then removed to create the circuits. Instead, to produce flexible circuit boards, they apply circuits made of copper to the film that serves as substrate. In the case of biosensors, palladium is used. They use plasma at atmospheric pressure and galvanization instead of vacuum-pressure and laser-based methods to achieve inexpensive and resource-efficient production.

Dr. Michael Thomas, director of the research group at IST, explains: “During production of circuits for an RFID antenna, you often have to etch away between 50 and 80 percent of the copper used. This results in considerable amounts of copper scrap that either has to be disposed or reprocessed using relatively elaborate methods.” The IST approach is different: there, scientists use the additive process to apply the structures they want directly to the substrate sheeting.

The first two process steps are plasma printing at atmospheric pressure and metallization using well-known galvanization methods. Plasma printing uses the kind of deeply engraved roller familiar from the area of conventional rotogravure printing. During the printing process, microplasms are electrically generated in the engraved recesses of the roller; these microplasms chemically alter the surface of the plastic substrate where the circuits are to be applied later in the process.

The process gas from which the plasma is created is usually a mixture of nitrogenous gases. As IST researcher Thomas emphasizes: “The chemical changes we need begin to form on the surface of the film; these changes ensure that the plastic can be wetted with water in these precise areas and will be metallizable using suitable plating baths. This means considerable savings of energy and material,” Thomas adds. And this is a decisive competitive factor: the prices for raw materials – for copper and palladium, for example – have risen by around 150 percent in the past three years.

In the joint P3T project sponsored by the German Federal Ministry of Education and Research (BMBF) P3T, researchers are currently working very hard to improve the individual processes involved in the manufacture of flexible circuit boards and biosensors. They are closely scrutinizing all of the P3T production steps – from plasma printing to assembly and coordinating all of the processes with one another in a production line.

Please visit our home page at: www.pcb-solutions.com We are a supplier of Domestic and off-shore Rigid, Rigid-Flex and Flex Printed Circuit Boards (PCBs), Domestic Military PCBs, Domestic Tier I PCBA, Domestic Sheet Metal, Domestic Injection Molding and other Custom Fabricated Services.

Data source: 2010-08-23 http://www.pcbpartner.com

As the global economy recovers, the international financial market goes stable, Orders shift crisis also comes to PCB industry for many PCB makers in China. On one hand, the middle-small PCB makers rely on OEM are unable to afford the pressure of cost rise by financial crisis.; on the other hand, serious shortage of workers bring many enterprise embarrassment of shut down. At the same time, with growth of workers wage cost, increase the pressure of the enterprise’s operation. It becomes the question for PCB manufacturers to think how to solve the new crisis.

Besides shortage of workers, PCB makers developed rely on OEM need to afford the affect of financial crisis and the price rise of material, source, energy shortage and high consumption. All this make the process cost rise in China, the price advantage is being eroded. Some international companies already shift the order to the low-cost Southeast Asian, South Asian countries like Vietnam, Cambodia, Bangladesh and Thailand. Under the situation of no significant decline in market demand, cancellation of orders in China, will inevitably be supplemented in other places.

The survey show, Japan IT enterprises have shift their PCB order to Thailand, PCB manufacturing companies in Thailand are also increasingly competitive Data shows PCB industrial value in southeast has already been 3-3.3 billion dollars, Thailand accounts 30-40% of the total. While the famous company like Gree, Supor,  Media, Glanz , Canon and so on have already built their own production plant in Vietnam.

Please visit our home page at: www.pcb-solutions.com We are a supplier of Domestic and off-shore Rigid, Rigid-Flex and Flex Printed Circuit Boards (PCBs), Domestic Military PCBs, Domestic Tier I PCBA, Domestic Sheet Metal, Domestic Injection Molding and other Custom Fabricated Services.

Good news for the industry continues to remain for the PCB and PCBA sectors. Key booking figures continue to be strong. Let’s hope it keeps rolling.

BANNOCKBURN, Ill., USA, July 26, 2010 — IPC — IPC — Association Connecting Electronics Industries® announced today the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

PCB Industry Growth Rates and Book-to-Bill Ratios Announced
Rigid PCB shipments were up 25.3 percent while bookings increased 29.3 percent in June 2010 from June 2009. Year to date, rigid PCB shipments were up 19.3 percent and bookings have grown 35.0 percent. Compared to the previous month, rigid PCB shipments increased 13.7 percent and rigid bookings increased 9.7 percent. The book-to-bill ratio for the North American rigid PCB industry in June 2010 stood at 1.12.

View all the charts in PDF

Flexible circuit shipments in June 2010 were up 14.8 percent, and bookings were up 11.0 percent compared to June 2009. Year to date, flexible circuit shipments increased 0.6 percent and bookings were up 15.5 percent. Compared to the previous month, flexible circuit shipments went up 28.1 percent and flex bookings declined 2.7 percent. The North American flexible circuit book-to-bill ratio in June 2010 remained high at 1.15.

View all the charts in PDF

For rigid PCBs and flexible circuits combined, industry shipments in June 2010 increased 24.4 percent from June 2009, as orders booked increased 27.8 percent from June 2009. Year to date, combined industry shipments were up 17.6 percent and bookings were up 33.4 percent. Compared to the previous month, combined industry shipments for June 2010 increased 14.8 percent and bookings went up 8.6 percent. The combined (rigid and flex) industry book-to-bill ratio in June 2010 was 1.12.

“The book-to-bill ratios for both rigid PCBs and flexible circuits remain well above parity, which suggests a positive outlook for the remainder of the year,” said IPC President & CEO Denny McGuirk.  “Sales growth is stabilizing, but year-on-year growth in both segments is continuing in double digits,” he added.

View all the charts in PDF

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample.  A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next two to three months.

View all the charts in PDF

Book-to-bill ratios and growth rates for rigid PCBs and flexible circuits combined are heavily affected by the rigid PCB segment. Rigid PCBs represent an estimated 90 percent of the current PCB industry in North America, according to IPC’s World PCB Production and Laminate Market Report.

The Role of Domestic Production
IPC’s monthly survey of the North American PCB industry tracks bookings and shipments from U.S. and Canadian facilities, which provide indicators of regional demand. These numbers do not measure U.S. and Canadian PCB production. To track regional production trends, IPC asks survey participants for the percent of their reported shipments that were produced domestically (i.e., in the USA or Canada). In June 2010, 83 percent of total PCB shipments reported were domestically produced. Domestic production also accounted for 83 percent of rigid PCB and 81 percent of flexible circuit shipments in June by IPC’s survey participants. These numbers are significantly affected by the mix of companies in IPC’s survey sample, which changed slightly in January, but are kept constant through the remainder of the year.

Bare Circuits Versus Assembly
Flexible circuit sales typically include value-added services such as assembly, in addition to the bare flex circuits. In June, the flexible circuit manufacturers in IPC’s survey sample indicated that bare circuits accounted for about 77 percent of their shipment value reported for the month. Assembly and other services make up a large and growing segment of flexible circuit producers’ businesses. This figure is also sensitive to changes in the survey sample, which may occur at the beginning of each calendar year.

Interpreting the Data
Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they may reflect cyclical effects. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month may not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The information in IPC’s monthly PCB industry statistics is based on data provided by a representative sample of both rigid and flexible PCB manufacturers in the USA and Canada. IPC publishes the PCB Book-to-Bill Ratio and the PCB Statistical Program Report each month. Statistics for the previous month are not available until the last week of the following month.

Contact:
Sharon Starr, IPC Director of Market Research
P:  +1 847-597-2817 begin_of_the_skype_highlighting +1 847-597-2817 end_of_the_skype_highlighting
E:  SharonStarr@ipc.org

# # #

About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.

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From http://www.researchandmarkets.com

In 2009, the output value of the global PCB industry reached about US$40.6 billion, down 15.83% over 2008. This was mainly caused by continuously decreasing PCB shipment and average prices. As for main sub-sectors, the output value of the global substrate, rigid PCB and flexible printed circuit (FPC) board sectors descended by 50%, 20% and 3.8% respectively compared with 2008. The decline of the global substrate and rigid PCB sectors is mainly due to the sharp drop of sales volume of desktops and medium to high-end notebooks. In comparison, the global FPC board sector declined more slightly in 2009, thanks to the growing number of LED backlight modules and Smart Phone FPC boards as well as the touch panel boom.

From 2000 to 2009, in terms of output value, computer, communications, industrial/medical, military and automotive PCBs decreased by 3%, 13.5%, 20.5%, 20.1% and 26.8% respectively, while consumer electronics PCB and package substrate increased by 15.8% and 68% respectively. Single-sided/double-sided PCB and multilayer PCB decreased by 37.3% and 25.2% respectively, while high-density interconnect (HDI) board, package substrate and FPC increased by 163.1%, 68.1% and 90.0% respectively.

In 2009, from the perspective of the global PCB distribution pattern, Mainland China, Japan and Taiwan were still the main production areas, South Korea continued to expand its PCB industry, while Europe and the United States were in recession. Compared with Japan and South Korea with advantages in high-end products such as IC substrate and FPC board, and Taiwan with advantages in mobile phone PCB, China, mainly engaged in single-sided PCB and multilayer PCB, is inferior in terms of the technical content of the PCB industry.

In 2009, China’s PCB industry for the first time saw its output value decline slightly by 3.6% to US$16.35 billion. Nevertheless, its share in the global PCB output value continued to rise. Among China’s top 100 PCB enterprises in terms of sales revenue, local ones performed well, for example, the sales revenue of Bomin Electronic rose by 150.7% over 2008.

Here is to a better 2010…

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Understanding material properties is critical in determining requirements for PCB manufacturing.  In this blog, we will look at the technical definitions, as well as an overview of why each property may be important to your designs.  All of these properties should be specified on the data sheet for most commonly used PCB materials.

PCB Solutions always recommends that you contact the material supplier and review their data prior to making a decision.  The data below is available to help you navigate the terms but does not serve as advice on which material to chose for your application because there are so many variables for Rigid, Rigid Flex and Flex PCB designs.

1. Dielectric Constant (Dk or Er):

Technical definition: The ratio of the capacitance of a capacitor with the given dielectric to the capacitance of a capacitor having air for its dielectric but otherwise identical.  The Dk value is calculated as the relative permittivity of a material.

Why this is important: The Dielectric Constant is a major factor in calculating and controlling impedance requirements of signals on PCBs.  All PCB materials (cores, prepregs, solder masks), have a Dk value.  The actual Dk value can vary based on resin content of materials.  Values typically range from 3.5 to 5.9.  Specific material is available for both very low Dk and Very high Dk values. A low Dk material is often used for RF applications while a high Dk is often used for High Frequency applications.

2. Glass Transition Temperature (Tg):

Technical definition: The temperature at which a polymer changes from hard and brittle to soft and pliable.

Why this is important: The Tg indicates the temperature at which the PCB base material starts yielding. It is important to avoid any yielding of PCB base materials, so the Tg is not an indicator for the operating temperature of the PCB. The Tg temperature can usually only be sustained for a very short time.  The actual minimum Tg required for your PCB will depend on many factors including surface finish and assembly process; however, the industry guideline for most ROHS applications in a minimum material Tg of 170 degrees C.

3. Decomposition Temperature (Td):

Technical definition: The temperature at which material weight changes by 5%.

Why this is important: The decomposition is the breaking of chemical bonds in the resin system. The resin in the laminate is basically burning up.  This value is widely considered to be more critical than the Tg value with regards to ROHS considerations during the assembly process.  Like Tg, the actual minimum Td required for your PCB will depend on many factors including surface finish and assembly process; however, the industry guideline for most ROHS applications in a minimum material Td of 340 degrees C.

4. Loss tangent (Dissipation Factor):

Technical definition: The ratio at any particular frequency between the real and imaginary parts of the impedance of the capacitor.

Why this is important: A large loss tangent means you have a greater amount of dielectric absorption, which can cause the value of capacitance to change with frequency.  If clean, consistent, capacitance is a requirement of your design, then look for a material with low loss tangent values. For high speed designs (greater than 1Ghz) it may be recommended to choose a material with a dissipation factor of less than .015.

5. Moisture Absorption:

Technical definition: Maximum percent of moisture absorbed by material in high-humidity conditions.

Why this is important: Absorbed moisture can raise Dk values, expand the board, and cause thermal defects such as substrate blisters, barrel cracking and delamination during assembly. If the PCBs are stored for only short times in low-humidity locations before assembly, then moisture may not be a problem. However if the PCBs are stored in high humidity for long periods of time, then they may need to be pre-baked before assembly.

6. Coefficient of Thermal Expansion (CTE):

Technical definition: A material’s fractional change in length for a given unit change of temperature.

Why this is important: Glass, copper, gold and nickel all have fixed expansion rates up to their respective melting points.  A large difference in laminate expansion rates can cause strain on the plated hole wall causing cracked barrels and lifted land patterns during the assembly process.  The common unit of measurement for CTE is ppm/°C, parts per million per degree centigrade. 1 ppm is equivalent to 0.0001% of total observed dimension. A material rated at 250 ppm/°C would change 0.025% in dimension for every degree change in temperature. On a .100” thick board over a 100°C temperature range there would be a total thickness change of 2.5% which equates to 0.0025”

7. Thermal conductivity:

Technical definition: Ability of a material to conduct heat.

Why this is important: As the power and density of components on a PCB rises, the need to dissipate heat through the base material of the PCB increases.

Materials that offer greater thermal conductivity can be utilized with designs that have high power, or high heat output devices such as LED’s, coils or relays.

9. Peel Strength

Technical definition: The strength of the bond between base material and copper cladding as measured by IPC-TM-650.

Why this is important: As components become smaller, their footprint or pad patterns also become smaller, resulting in much less area of contact between the base material and the copper land patterns.  The strength of the bond at this area will determine the ability of the pads to avoid lifting from the material surface.

10. Arc Resistance

Technical definition: Measure of electric breakdown condition along an insulating surface, caused by the formation of a conductive path on the surface.

Why this is important: Typically a consideration for high-voltage/high power PCBs.  Arc resistance is a measurement, in seconds, of the amount of time for breakdown along the surface of the material.

If you have questions regarding materials or anything else PCB- Send us an email at info@PCB-solutions.com and we will be happy to guide you in the right direction.

Please visit our home page at: www.pcb-solutions.com We are a supplier of Domestic and off-shore Rigid, Rigid-Flex and Flex Printed Circuit Boards (PCBs), Domestic Military PCBs, Domestic Tier I PCBA, Domestic Sheet Metal, Domestic Injection Molding and other Custom Fabricated Services.

BANNOCKBURN, Ill., USA, June 25, 2010 — IPC — IPC — Association Connecting Electronics Industries® announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

PCB Industry Growth Rates and Book-to-Bill Ratios Announced
Rigid PCB shipments were up 31.4 percent while bookings increased 45.8 percent in May 2010 from May 2009. Year to date, rigid PCB shipments were up 18.0 percent and bookings have grown 36.3 percent. Compared to the previous month, rigid PCB shipments increased 1.3 percent and rigid bookings increased 6.5 percent. The book-to-bill ratio for the North American rigid PCB industry in May 2010 continued its climb to 1.13.

View all the charts in PDF

Flexible circuit shipments in May 2010 were up 10.5 percent, and bookings were up 59.3 percent compared to May 2009. Year to date, flexible circuit shipments were down 2.6 percent and bookings were up 16.7 percent. Compared to the previous month, flexible circuit shipments went up 16.0 percent and flex bookings grew by 33.4 percent. The North American flexible circuit book-to-bill ratio in May 2010 made a long leap up to 1.18.

View all the charts in PDF

For rigid PCBs and flexible circuits combined, industry shipments in May 2010 increased 29.6 percent from May 2009, as orders booked increased 46.8 percent from May 2009. Year to date, combined industry shipments were up 16.2 percent and bookings were up 34.7 percent. Compared to the previous month, combined industry shipments for May 2010 increased 2.2 percent and bookings went up 8.3 percent. The combined (rigid and flex) industry book-to-bill ratio in May 2010 increased to 1.13.

“Both yearly and monthly growth rates in the North American PCB industry are now positive,” said IPC President & CEO Denny McGuirk. “That means the industry is not only doing better than last year, but is growing monthly as well. Despite strong sales,” he added, “orders are growing even faster. That keeps moving the book-to-bill ratio up, which indicates continued sales growth this year.”

View all the charts in PDF

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next two to three months.

View all the charts in PDF

Book-to-bill ratios and growth rates for rigid PCBs and flexible circuits combined are heavily affected by the rigid PCB segment. Rigid PCBs represent an estimated 90 percent of the current PCB industry in North America, according to IPC’s World PCB Production and Laminate Market Report.

The Role of Domestic Production
IPC’s monthly survey of the North American PCB industry tracks bookings and shipments from U.S. and Canadian facilities, which provide indicators of regional demand. These numbers do not measure U.S. and Canadian PCB production. To track regional production trends, IPC asks survey participants for the percent of their reported shipments that were produced domestically (i.e., in the USA or Canada). In May 2010, 84 percent of total PCB shipments reported were domestically produced. Domestic production also accounted for 84 percent of rigid PCB and flexible circuit shipments in May by IPC’s survey participants. These numbers are significantly affected by the mix of companies in IPC’s survey sample, which changed slightly in January, but will remain constant through the remainder of the year.

Bare Circuits Versus Assembly
Flexible circuit sales typically include value-added services such as assembly, in addition to the bare flex circuits. In May, the flexible circuit manufacturers in IPC’s survey sample indicated that bare circuits accounted for about 58 percent of their shipment value reported for the month. Assembly and other services make up a large and growing segment of flexible circuit producers’ businesses. This figure is also sensitive to changes in the survey sample, which may occur at the beginning of each calendar year.

Interpreting the Data
Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they may reflect cyclical effects. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month may not be significant unless a trend of three consecutive months or more is apparent. It is also important to consider changes in bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The information in IPC’s monthly PCB industry statistics is based on data provided by a representative sample of both rigid and flexible PCB manufacturers in the USA and Canada. IPC publishes the PCB Book-to-Bill Ratio and the PCB Statistical Program Report each month. Statistics for the previous month are not available until the last week of the following month.

Contact:
Sharon Starr, IPC Director of Market Research
P:  +1 847-597-2817
E:  SharonStarr@ipc.org

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Something that electronics purchasers are suffering from at the moment is long delivery times on printed circuit boards. Something that often occurs during economical upturns.

The PCB delivery shortage is partly due to the limited availability of PCB laminates. In turn this is due to increased copper deficiency, something that happens in most economic upturns. This has resulted in a sudden price increase for the laminate. The price increase in China is around 20% and in extreme cases 25%. This price increase is not reflected fully in the total PCB price. If the laminate price in China increases by 20% the PCB price tends to increase approximately 15%, a source told Evertiq. It is also more likely that price increases are higher from Chinese manufacturers than from European manufacturers, the source noted.

PCB delivery shortage is not the biggest problem that electronics buyers today are suffering from. The lack of components allow buyers to wait even longer after the PCBs have been delivered. Several semiconductor giants have delivery times around 20 weeks at present and 3 days just to get the components out from the warehouses, according to an electronics purchaser. It has happened several times that many component manufacturers have not prioritized to recognize purchasing orders.

Several European PCB manufacturers told Evertiq that they are running on full production at the moment. On the PCB-trading side, the average delivery time on trading volumes from PCB distributors is 5-6 weeks. Just a few months ago, the delivery time was 3-4 weeks.

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BANNOCKBURN, Ill., USA, March 25, 2010 — IPC — IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

PCB Industry Growth Rates and Book-to-Bill Ratios Announced
Rigid PCB shipments were up 9.4 percent while bookings increased 36.4 percent in February 2010 from February 2009. Year to date, rigid PCB shipments were up 3.6 percent and bookings have grown 27.9 percent. Compared to the previous month, rigid PCB shipments increased 4.7 percent and rigid bookings increased 8.1 percent. The book-to-bill ratio for the North American rigid PCB industry in February 2010 grew to 1.09.

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Flexible circuit shipments in February 2010 were down 2.1 percent, but bookings were down 37.4 percent compared to February 2009. Year to date, flexible circuit shipments were down 3.1 percent and bookings were down 0.4 percent. Compared to the previous month, flexible circuit shipments went up 4.9 percent and flex bookings fell by 36.4 percent. The North American flexible circuit book-to-bill ratio fell below parity to 0.92.

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For rigid PCBs and flexible circuits combined, industry shipments in February 2010 increased 8.5 percent from February 2009, as orders booked increased 29.1 percent from February 2009. Year to date, combined industry shipments were up 3.0 percent and bookings were up 25.6 percent. Compared to the previous month, combined industry shipments for February 2010 increased 4.8 percent and bookings went up 4.5 percent. The combined (rigid and flex) industry book-to-bill ratio in February 2010 increased to 1.07.

“Rigid PCB bookings have outpaced shipments for the past 11 months. That’s reflected in the high rigid PCB book-to-bill ratio and it’s an encouraging indicator of future growth,” said IPC President & CEO Denny McGuirk. “We saw a big drop in flexible circuit orders in February, but no sign of a trend yet, due to the volatility of flex orders and sales.”

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The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next two to three months.

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Book-to-bill ratios and growth rates for rigid PCBs and flexible circuits combined are heavily affected by the rigid PCB segment. Rigid PCBs represent an estimated 90 percent of the current PCB industry in North America, according to IPC’s World PCB Production and Laminate Market Report.

Book-to-bill ratios and growth rates for rigid PCBs and flexible circuits combined are heavily affected by the rigid PCB segment. Rigid PCBs represent an estimated 90 percent of the current PCB industry in North America, according to IPC’s World PCB Production and Laminate Market Report.

The Role of Domestic Production
IPC’s monthly survey of the North American PCB industry tracks bookings and shipments from U.S. and Canadian facilities, which provide indicators of regional demand. These numbers do not measure U.S. and Canadian PCB production. To track regional production trends, IPC asks survey participants for the percent of their reported shipments that were produced domestically (i.e., in the USA or Canada). In February 2010, 83 percent of total PCB shipments reported were domestically produced. Domestic production accounted for 85 percent of rigid PCB and 68 percent of flexible circuit shipments in February by IPC’s survey participants. These numbers are significantly affected by the mix of companies in IPC’s survey sample, which changed slightly in January, but will remain constant through the remainder of the year.

Bare Circuits Versus Assembly
Flexible circuit sales typically include value-added services such as assembly, in addition to the bare flex circuits. In February, the flexible circuit manufacturers in IPC’s survey sample indicated that bare circuits accounted for about 56 percent of their shipment value reported for the month. Assembly and other services make up a large and growing segment of flexible circuit producers’ businesses. This figure is also sensitive to changes in the survey sample, which may occur at the beginning of each calendar year.

Interpreting the Data
Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they may reflect cyclical effects. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month may not be significant unless a trend of three consecutive months or more is apparent. It is also important to consider changes in bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The information in IPC’s monthly PCB industry statistics is based on data provided by a representative sample of both rigid and flexible PCB manufacturers in the USA and Canada. IPC publishes the PCB Book-to-Bill Ratio and the PCB Statistical Program Report each month. Statistics for the previous month are not available until the last week of the following month.

About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

Please visit our home page at: www.pcb-solutions.com We are a supplier of Domestic and off-shore Rigid, Rigid-Flex and Flex Printed Circuit Boards (PCBs), Domestic Military PCBs, Domestic Tier I PCBA, Domestic Sheet Metal, Domestic Injection Molding and other Custom Fabricated Services.

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U.S. Tech Market Shows Signs of Life
A Refresh Cycle At Last

April 10, 2010
By Larry Barrett

Thanks to a boost from a substantial corporate upgrade cycle and the improved demand for strategic software investments in Software-as-a-Service (SaaS) and service-oriented architecture (SOA) projects, the U.S. technology market is poised for robust rebound in 2010, according to Forrester Research’s latest report.

After years of delaying or truncating investment in new equipment and software, enterprise customers are finally opening up their wallets for IT purchases that improve overall organizational efficiency and help companies differentiate themselves from their competitors, researchers said.

“The tech downturn of 2008 to 2009 is unofficially over,” Andrew Bartels, a Forrester vice president and principal analyst, said in the report. “With growing evidence that an economic recovery started in the US and other countries in Q3 2009, the pieces are in place for a 2010 tech spending rebound.”

In 2010, Forrester is predicting the total U.S. IT market will grow 8.4 percent, up from the 8.1 percent improvement it previously forecast. It now expects global IT spending will improve about 7.7 percent this year, a little slower than it previously forecast mainly due to international currency fluctuations.

Computer equipment, particularly the replacement of older PCs, servers and storage equipment, is now expected to surge 11.1 percent from 2009 while software sales will improve 10.5 percent.

“For software, growth will result from a mixture of the revival of deferred licensed software purchases following the 2009 capital freeze, ongoing growth in SaaS software, and continued strong growth in smart computing platform technologies like service-oriented architecture (SOA) infrastructure, virtualization software, and analytics,” the report said.

Computer equipment sales are now projected to rise to around $83 billion with PCs accounting for roughly $39 billion of that. Communications equipment will top out at $108 billion, while telecom services and IT services and outsourcing spending will check in at $191 billion and $165 billion, respectively.

Total U.S. business and government IT spending will total more than $741 billion this year, of which about $194 billion will be spent on software — the single largest category. New applications will represent $88 billion in investment, followed by custom applications at $43 billion and middleware and operating systems software coming it at $52 billion and $11 billion apiece.

Forrester’s findings dovetail with early projections from major manufacturers, software developers and independent research firms.

Gartner earlier this year predicted total PC unit shipments would improve more than 20 percent this year to a total of more than 366 million units shipped, up from 305.8 million units in 2009.

By industry, Forrester expects U.S. financial services and insurance companies to increase their total IT spend by 11.4 percent this year while manufacturers and telecom companies will ramp up their IT spending by 9.8 percent and 9 percent, respectively.

Larry Barrett is a senior editor at InternetNews.com, the news service of Internet.com, the network for technology professionals.

Please see us at: www.pcb-solutions.com is a supplier of Domestic and Asian Rigid, Flex and Rigid-Flex Printed Circuit Boards (PCBs), Domestic Tier I PCBA, Domestic Sheet Metal, Domestic Injection Molding and other Custom Fabricated Services

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James Brown
V.P. Sales & Marketing
PCB Solutions, LLC
jamesb@pcb-solutions.com