Flex Circuits

Single-Sided

Covering a layer of preservative after etching the circuit on a single-sided PI coated copper board to form a FPC with single-layer conductor.

Normal Double-Sided

Covering a layer of preservative on each side of a double-sided PI coated copper board after etching the circuit on the two sides of the board to form a circuit board with doublelayer conductor.

Multi-Layer

Pressing and gluing several singlesided PI coated copper boards with pressure-sensitive adhesive using the similar technique as that of Double-sided Printed Board with Substrate to form a circuit board with multi-layer conductor structure and a high pliability at the non-glued part.

Rigid-Flex

Forming a multi-circuit board making use of flexible board's high pliability and rigid board's high supporting ability.

Flex Capabilities

Up to 12 Layers
Size up to 10" X 18"
.0005", .001", and .002" base PI material
.0005", .001", .002" and .003" PI coverlay film
Blind and buried vias
Eco-Bond available
PI or FR4 stiffeners
Laser trimming
IPC 6013 Class 2 and IPC-A-600 inspection standards
IPC-TM-650, GB/T4677-2002 Test standards
Design consultation available