Printed Circuit Boards
Lead Time
Domestic:
Prototypes
Double Sided: 24-48 Hours + Transit (cut off 9:00 a.m. PST)
Multilayer: 24-48 Hours + Transit (cut off 9:00 a.m. PST)
Pre-Production
Double Sided: 3-4 Days + Transit
Multilayer: 4-5 Days + Transit
Off Shore:
Prototypes
Double Sided: 3 Days + Transit
Multilayer: 4 Days + Transit
Pre-Production
Double Sided: 4-5 Days + Transit
Multilayer: 5-6 Days + Transit
Mass Production
Repeat P/Ns: 2-3 Weeks + Transit
New P/Ns: 3-4 Weeks + Transit
Quality Control
Quality Controls:
All suppliers have UL certifications and ISO Certifications
All suppliers work to IPC standards ( IPC 600 Rev F www.ipc.org )
Testing: PCBs are tested at the highest level which includes but is not limited to:
Automated Optical Inspection (AOI)
Electrical Test (E-Test/100% Net List Test)
High Pot Testing Available
Documentation: Each Shipment of PCBs include the following documentation:
Certificates of Conformance (CofC)
Electrical Test Certificates
Cross Section Analysis
High Pot Test Certificates
Solder Samples (included upon request)
Production Capabilities
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Standard Boards
Single Sided
Double Sided |
Minimum Finished Hole Size
.008" |
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Multilayer
4-20 Layer Boards
004" Line Width
004" Air Gap |
Controlled Impedance
+/- 10% |
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Minimum Board Thickness
. 008" (2 layer)
. 016" (4 layer)
. 016" +/- 0.004" (6 layer)
. 032" +/- 0.004" (8 layer) |
Value-Added Capabilities
Blind Vias
Buried Vias
Micro Vias |
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Maximum Board Thickness
. 250" |
Fabrication
N/C Routing
V-Scoring/Punching |
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Maximum Panel Size
24" x 28" |
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| IPC-A-600 Rev G |
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Surface Finishes & Materials
Surface Finishes
Hot Air Solder Level (HASL)
Pb-Free HASL
Entek
Immersion Gold (ENIG) 2-5u”
Electro-Plated Gold (HARD)
Carbon Ink
Gold Fingers (>30u”)
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Board Materials
FR-4 (130°C Tg)
FR-406 (170°C Tg)
CEM
Rogers
Teflon
Polyimide
BT Resin |
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Solder Mask
LPI Standard
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Inspection
Automated Optical Inspection (AOI)
Electrical Test
Flying Probe Test
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(E-Test/100% Net List Test)
High Pot Testing Available
IPC 600 Rev. |
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