New Printed Circuit Board Flex Engineering and Design Project another Big Hit with Customer

PCB Solutions just finished another flex printed circuit board (partial) engineering and design project that was a big hit with our customer.  Noted below is a project we just completed which we helped with the material construction which included the stack-up details.  Here are some of components of the fabrication of this Flex PCB:

  • ½ oz copper core plated to 1oz finished copper
  • Electroless Immersion Gold (ENIG)
  • Material: DuPont Kapton;
  • 2 conductor layers,
  • 1 oz. copper,
  • 1 mil Kapton;
  • Overall board thickness: 0.007” ± 0.002”.  0.2mm +/- .03mm thickness

The customer presented us with the basic drawing and Gerbers files of the board layout. Our engineers took the files from there and made recommendations on stackup to make sure the customer could meet the specs they desired.

With PCB Solutions, you receive so much more than a finished product – which includes but is not limited to factory engineered drawings of your product and all the outgoing reports showing final inspection results. We go the extra mile prior to production to make sure the product is what the customer needs and then send the documentation to prove results.

Partial Final Engineering Drawings supplied from our process engineers:

Flex Circuit Engineering Drawing 1

 

Flex Circuit Engineering Drawing 2

 

 

 

 

Flex Circuit Engineering Drawing 3

Final Inspection Reports detailing the specifications of the Flex PCB:

CustomerPCB Solution
Customer P/N
Customer P/O13763
P/ND06742

Lot Number

41pcs
Standard

IPC-6013A

Qty

8pcs
  1. Materials
ItemRequirement

Result

Structure       Flex Board 2 Layer(s)Rigid-Flex Board  Layers

Acc

Base FilmPI0.5mil     1mil   2mil    Other     milAdhesive      Adhesiveless

Acc

Base CopperED0.5oz  1oz    2oz    Other    oz

Acc

LaminateFR4   Other

/

CoverlayPI0.5mil  1mil   2mil    Other    mil

Acc

Stiffener■PI    FR4    Other

/

Stiffener Adhesive3M467    Hot Cured Adhesive    Other

/

Solder maskType颜色Color

/

Nanya   Taiyo psr-4000Other Green YellowBlack  Other

/

C/MTypeColor

Position

/

ZM-400WFM-211WOther  White  BlackOther TopBottom

2、Electric Test

Test Condition

Result

Test Voltage

Test Current

Conductive Resistance

Insulation Resistance

Acc

150V

180mA

10Ω

100MΩ

3. Line Wide & Spacing Measurement     (Unit: mm)

Item

Requirement

Actual

Result

4.Surface Plating Technic & Plating Thickness

RequirementActual

Result

 ENIG

Thickness: Ni (1-3um); Au (0.025-0.05um) ENIG

Thickness: Ni (  1.3  um); Au (  0.03   um)

Acc

 Plating Gold

 

Thickness: Ni (1-3um)Au(0.05~0.075  um) Plating Gold

Thickness: Ni (     um); Au (   um) Flash Gold

Thickness: Ni (2~5um); Au (0.05~0.1um) Flash Gold

Thickness: Ni (     um); Au (     um) Gold Finger

Thickness: Ni (2~5um); Au (0.05~0.1um) Gold Finger

Thickness: Ni (     um); Au (     um) HAL

Thickness: Sn (2~40um) HAL

Thickness: Sn (     um) HAL Lead-Free

Thickness: Sn (3~7um) HAL Lead-Free

Thickness: Sn (      um) Immersion Tin

Thickness: Sn (0.25~1um) Immersion Tin

Thickness: Sn (        um) Immersion Ag

Thickness: Ag (≥0.8um) Immersion Ag

Thickness: Ag (     um)OSP

Thickness: OSP (0.3~0.5um) OSP Thickness: OSP(     um)

5. Marking Inspection

Item

Requirement

Actual

Result

Inspection

FP Logo

Additional Marking

UL Logo

Date CodeFP Logo

Additional Marking

UL Logo

yyww      wwyy

6.Size Measurement Unit mm)

Item

Requirement

Actual

Result

Board Thickness

Rigid

/

/

/

/

/

Flex

/

/

/

/

/

Stiffener Area Thickness

/

/

/

/

/

/

/

/

/

/

/

/

/

/

/

Outline Size

29.91±0.10

29.92

29.90

29.92

Acc

5.19±0.10

5.20

5.21

5.20

Acc

/

/

/

/

/

/

/

/

/

/

Warpage Measurement

/

/

/

/

/

V-CUT

V-CUT Measurement

B:

H:

&:

B:

H:

&:

B:

H:

&:

B:

H:

&:

/

Gold Finger Measurement

7. Mechanical Dimension

PROFILE

HOLE

SPEC & TOL(MM.)

RESULT(MM.)

SPEC & TOL(MM.)

RESULT

1

29.91±0.10

29.92

29.90

29.92

29.91

29.92

/

/

2

5.19±0.10

5.20

5.21

5.20

5.19

5.20

/

3

1.00±0.05

1.01

1.00

1.02

1.00

1.01

4

0.50±0.05

0.50

0.49

0.51

0.48

0.50

5

0.20±0.03

0.21

0.20

0.20

0.21

0.20

Resistance Measurement Report

SPEC & TOL(ohm)

RESULT(ohm)

OK/NG

1

/

/

2

3

4

 

8. Visual Inspection

Inspection Standard

Requirement

Actual

Result

IPC-6013

IPC-6013 & Customer requirement

No Visual defects

 No defects

Acc

9. Other Requirement

(120℃,120)。The PCB need to bake before solder (Temp 120℃,Time 120min).

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