Rigid PCB Offshore Prototype

PCB Solutions proudly Fabricates a variety of domestic circuit board solutions. Our team is specialized in high-tech, quick turn capabilities serving engineering and preproduction units of all types. Our customer list includes: Raytheon, Tesla, Emerson, DuPont, HPe, Jabil, IPS Aerospace and many other Tier I OEMs and Contract manufacturers.

Our team keeps electrical engineers moving

  • Offshore Quick Turn & Hi-Tech Fabrication
    • Quick Turn & Prototyping
    • 2 – 7 Working Day Quick Turns
    • 10 Working Day Standard
    • 24 Hour Quoting
  • Engineering, CAM & Order Processing – Team of CAM engineers reviewing the finite details using Pentalogix CAM Master software. All CAM engineers and operators have over 15 years of experience running DFM & DRC reviews.
    • Preliminary review of all data sets
    • Design Rule Checks (DRC)
    • Design For Manufacturing (DFM)
    • ODB++ / DXF / 274X file formats
    • Polar Software for Impedance Control, Modeling & Stack Ups
    • Net List Review and Comparison
  • PCB Production Capabilities
    • Layer Count: 2-50
    • Board Thicknesses: .2mm – 8mm
    • Blind & Buried Vias
    • Max Panel: 49” x 22.5”
    • Via In Pad
      • Non-conductive
      • Conductive
    • AOI (Automated Optical Inspection) for Outer and Inner layers
    • Plated Slots, Plated Edges, Selective Plating, Controlled Impedance, Countersink / Counterbore, Score, Planar Transformers, Printed Antennas…
    • Flying Probe / Clam Shell Electrical Testing (E-Test)
  • Production Tolerances
    • .003” Line Trace & Space
    • .006” Hole Size (.008” Mechanical Drill) on .062” thicknesses
    • Aspect Ratio of 40:1
  • Surface Finishes
    • 63/37 Solder – Hot Air Solder Level (HASL)
    • Electroless Nickel Immersion Gold (ENIG)
    • Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
    • HASL
    • Lead Free Solder (LF-HASL)
    • Immersion Silver
    • Immersion Tin
    • Flash Gold
    • OSP
    • Electrolytic Hard Gold 30-100 micro inches
    • Electrolytic Sold Gold 30-100 micro inches
  • High Density Interconnector (HDI)
    • Low Volume & Mass Production: 4+C+4
    • Mass Production 3+C+3
    • Laser Via (Via Plugging)
    • Min Microvias hole size: 4mil
  • Fabrication Specifications & Guidelines
    • IPC-600, IPC-6012 Classes II & III
    • UL Approved, 94V-0 Flammability Rating
    • ISO9001:20???
    • Calibration under ISO to NIST Standards
  • RoHS Compliant Laminates
    • Standard FR-4
    • High Tg FR-4
    • Halogen free
  • Specialty Laminates
    • High Frequency
    • Rogers, Arlon, Taconic, Nelco (Quoted lead times required)
  • Copper Weight Capabilities
    • Finished Outer Layers: 1oz -6oz
    • Inner Layer Ground Plane: .5-4oz Cu
    • Inner Layer Signal: .5-3oz Cu
  • Solder Mask Options
    • Green, Blue, Black, Red, White, Clear ?
    • Matte & Glossy